Jezdan Gomez

Engineering, documentation and 3D models for photonics

Optical and circuit design, EUV and DUV thin-film optics, and the datasheets, application notes, 3D models and drawings that support photonics components.

λ 13.5 nm

Extreme ultraviolet

Mo/Si multilayer mirrors and free-standing filters, modeled with CXRO data

EUV and DUV optics

Services

All services

EUV filter and multilayer mirror design

Design and modeling of thin films for 13.5 nm transmission and reflection: free-standing filters on their support mesh, and Mo/Si multilayer mirrors with the period and capping layer set for the required angle and bandwidth. Spectral purity modeling covers how much of the source’s deep-UV and infrared light passes the filters to the mask and wafer.

EUV Insight, a browser app for EUV thin films and multilayers built by Jezdan Gomez, is used to compare materials and thicknesses, run thickness tolerances and export spectra for reports and datasheets. DUV coatings and filters for 193 nm and 248 nm are also covered.

Multilayer stack and calculated reflectance spectrum

euvinsight.com
EUV Insight workspace showing a multilayer stack and its calculated reflectance spectrum
R peak
73.80%
Peak wavelength
13.49nm
Bandwidth (FWHM)
0.622nm
Total thickness
278.5nm

Values from the results panel in the screenshot, for a Ru cap on 40 Mo/Si bilayers with a 6.9 nm period on a Si substrate.

Photodiodes and readout electronics

Photodiode front-end design from the device model to the finished board: TIA configuration, bias and filtering, noise and bandwidth, and SPICE and MATLAB simulation with your photodiode as a device model to verify the circuit meets the requirements.

Deliverables continue through the KiCad schematic and PCB layout, the 3D model and a datasheet written from the same model and test data. Available as individual steps or as the complete chain.

PIN photodiode cross-section

Whν+holeelectronEVR RL Iph anodecathode
Not to scale. The depletion width and capacitance are computed from the reverse bias you set.

Schematic and photodiode model

R1 100 kΩC1 0.68 pFD1Cj 10 pFU1GBW 50 MHz−5 VVOUT
Transimpedance amplifier for a photodiode, drawn as a KiCad-style schematic. R1 sets the gain and C1 keeps the stage stable.

Photodiode design process

  1. Photodiode device modelMeasured responsivity, dark current, capacitance and shunt resistance become an equivalent circuit for simulation.
  2. TIA and readout circuitFeedback resistor and capacitor, op-amp choice, bias, bandwidth, noise gain and stability, worked out by hand first.
  3. MATLAB and SPICE simulationThe circuit runs with the device model across bias, temperature and part tolerances.
  4. Verification against requirementsEvery requirement gets a pass or a fail, with the simulation or measurement that backs it.
  5. KiCad schematic and PCB layoutSchematic and board in KiCad, with short input traces and a guard ring around the summing node.
  6. 3D modelA STEP model of the board and the photodiode package for your mechanical team.
  7. Datasheet and app noteDatasheet curves and an application note built from the same model and test data as the hardware.

From 13.5 nm EUV to 5 µm in the mid-infrared

Application notes, selection guides and datasheets, plus CAD and circuit design, for parts that work anywhere in this range.

  • EUV and DUV

    For makers of multilayer mirrors, excimer optics and lithography subsystems: application notes on reflectance and layer tolerances, and datasheets for DUV coatings and CaF₂ optics. EUV Insight is the thin-film design tool for this band.

  • UV and visible

    For laser, filter and microscope optics makers: selection guides that match filter sets to laser lines, datasheets that state their test conditions, and an AOI shift calculator for your filters.

  • NIR and SWIR

    For diode laser, fiber and LiDAR optics makers: application notes on TEC control and wavelength drift, such as the TEC heat-load sample, product pages for telecom and LiDAR filters, and photodiode front-end circuit design.

  • MWIR

    For IR material, lens and QCL makers: transmission and coating datasheets, and lens selection guides for germanium and chalcogenide glass.

Sample projects

Each sample cites its public references, and every figure and table in it is computed from code.

TEC control for laser wavelength stability

Application note, 8 pages, with a TEC heat load calculator.

Open the PDF (opens in a new tab)

Datasheet, before and after

A thin datasheet for a filter family, rewritten with its test conditions, typical values kept apart from limits, and curves drawn from code.

Open the PDF (opens in a new tab)

EUV Insight is a browser app for optics engineers designing EUV thin films and multilayer optics.

EUV Insight workspace

euvinsight.com
EUV Insight workspace showing a multilayer stack and its calculated reflectance spectrum
EUV Insight: a multilayer stack and its calculated reflectance spectrum.
Jezdan Gomez

Jezdan Gomez

Technical documents, browser calculators and circuit design, plus CAD files prepared from your released drawings.

How projects workVentura County, California

Industries served

Photonics and optics component makers, typically 20 to 400 people, that need application notes, product documentation or tools for selecting parts.

The same work suits makers of precision components in test and measurement, scientific instruments, motion and industrial automation.

  • Filters and coatings
  • Precision, molded and IR optics
  • Polarization optics
  • Laser modules, laser drivers and TEC controllers
  • Fiber components
  • Electro-optic and acousto-optic devices
  • Photonic integrated circuits
  • The optics of spectroscopy, imaging and metrology instruments
  • Laser and broadband light sources
  • Optomechanics and motion

Project packages

Start with one small project or a full kit. Every price is agreed before work starts.

Smaller projects

A capability card, a datasheet refresh, a technical article or a product-page rewrite.

App Note Sprint

One application note with a worked example and supporting calculations.

Product Launch Package

Datasheet refresh, product page, technical article, three posts and the launch email, timed to your launch.

Design-In Kit

Application note, selection guide, a design calculator, a sales one-pager and a technical FAQ.

Request a quoteRecommended

Monthly retainers are available for ongoing documentation and calculator work.

Trade show, print and marketing design

Technical content written and checked for booths, banners, brochures, catalogs and booklets, with design by Pento Agency (opens in a new tab), who designed and built this site. One point of contact from the brief to the print-ready files.

10 × 10 ft inline trade show booth

Optical filtersBandpass, longpass and notch,250 to 2000 nmNarrowbandpass3048 [120]3048 [120]2438 [96]1016 [40]850 [33.5]
Illustrative sample. Dimensions in mm [in].

Product photography

See the gallery

Macro photographs of optical and electronic parts on white, for datasheets, product pages, catalogs and trade-show graphics.

  • Gold can with a wide window over a large round die on a green substrate
    Gold can with a wide window over a large round die on a green substrate
  • Gold-plated flange-mount can with a round window and long gold leads
    Gold-plated flange-mount can with a round window and long gold leads
  • Ceramic chip carrier with a 4 × 4 die array and gold wire bonds
    Ceramic chip carrier with a 4 × 4 die array and gold wire bonds
  • Gold-plated round header with a four-segment ring die around a center opening
    Gold-plated round header with a four-segment ring die around a center opening
  • Gold-plated can with a blue window set in a white ceramic face
    Gold-plated can with a blue window set in a white ceramic face
  • Bonding tool feeding a fine wire into a windowed ceramic package
    Bonding tool feeding a fine wire into a windowed ceramic package

Start with a free review of your technical content

Get a one-page comparison of your technical content with two competitors, three recommended documents or tools, and a price for the first project.